Simulysis Blog

Engineering challenge:

Heat generating devices, such as high power electronic equipments and heat exchangers are widely applicable in engineering fields such as the automobile industry, power system, heating and air conditioning, chemical engineering, electronic chip cooling, and in the aerospace and nuclear energy sectors. Heat generation can cause overheating problems and thermal stresses and may leads to system failure. The removal of heat from these devices has been a critical challenge to thermal design engineers and researchers. 

Heat generating devices are designed in such a way as to optimise the structural geometry by packing and arranging array of cooling channels into given and available volume constraint without exceeding the allowable temperature limit specified by the manufacturers. For example, in the design of an electronic package, it is desirable to pack as many of the electronic chips as possible into in a fixed volume. This translates into the maximisation of heat transfer density or the minimisation of overall global thermal resistance, which is a measure of the thermal performance of the cooling devices. 

The objective is to study the conjugate heat transfer in cooling channels with variable cross-sections. Five different cross-sectional shapes of cooling channels are introduced, namely  square, circular, equilateral triangular and rectangular cooling channels. For the analysis, first different joints are modeled and meshed (Pre-Processing). The mesh file is then imported to a solver and different material property required for solving has to be specified. The necessary boundary conditions should also be given. The solving is then carried out and various results are then viewed in a Post-Processor.


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